The AS585x Eval Kit is a stand-alone system, which allows the AS585x complete configuration, the measurement of all the relevant parameter (like noise and input linearity) and the connection to an X-ray photodetector panel.
Two different AS585x samples are included in the Eval Kit in order to perform the complete evaluation:
1. AS585x Chip-on-Board (COB) sample: The AS585x die is directly bonded to the AS585x sample board, which is equipped with the signal generator circuitry. Such circuitry allows the generation of the input signals that emulate the photodetector as on the real application.
2. AS585x Chip-on-Flex (COF) sample: The default package type of the AS585x, where the die is bonded on a flex substrate. Such package allows the direct connection to an X-ray photodetector panel.
Each channel front-end consists of a charge sensitive amplifier (CSA) and a correlated double sampler (CDS), that removes offset and flicker noise from the signal, which is then converted to digital. A fast and reliable LVDS interface transmits the output digital data off-chip. Built-in diagnostic functionalities enable error detection in the signal chain. Voltage references and a temperature sensor are included on the chip. An SPI interface allows easy programming of the device parameters.
Four different power modes allow the user to minimize the current consumption for the chosen speed. Line times of 20, 28.5, 40 and 80 μs require as little as 3.1, 2.6, 1.6 and 1.1 mW per channel respectively. A special ADC operation mode is also available, that decreases the minimum line time to 15 μs without increasing the power consumption. Additionally, it is possible to add together the charges in pairs of adjacent channels; with this binning, the fastest achievable line time is 10 μs.