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Evaluation Kit for AS585x

General description

The AS585x Evaluation Kit is a stand-alone system, supporting all devices of the AS585x family. It allows the complete device configuration, the measurement of all the relevant parameters (like noise and input linearity) and the connection to an X-ray photodetector panel.

Two different AS585x samples are included in the Evaluation Kit in order to perform the complete evaluation:
1. AS585x Chip-on-Board (COB) sample: The AS585x die is directly bonded to the AS585x sample board, which is equipped with the signal generator circuitry. Such circuitry allows the generation of the input signals that emulate the photodetector as in the real application.
2. AS585x Chip-on-Flex (COF) sample: The default package type of the AS585x, where the die is bonded on a flex substrate. Such package allows the direct connection to an X-ray photodetector panel.

Other information

Type Description Language
Image Evaluation Kit Picture 1
Image Evaluation Kit Picture 2


Type Description Language
Evaluation Software AS585x_EvalSW_v2-0-0.exe GUI for the ams AS585x Eval Kit EN
Evaluation Software AS585x_EvalSW_UserGuide-UG000439_v3-0-0.pdf AS585x EvalKit User Guide EN
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