高性能 ToF 传感

艾迈斯半导体的飞行时间传感器基于其专有的 SPAD(单光子雪崩光电二极管)像素设计和具有极窄脉宽的时间-数字转换器 (TDC)。它们能够实时测量从物体反射的 VCSEL(激光)发射器的红外线的直接飞行时间。

这种低功耗飞行时间传感技术使主机系统能够以极高的速度精确测量距离。占位检测、用户脸部识别、高级相机等各种应用都需要用到高精度距离测量技术。

基于直方图的架构和智能算法

得益于艾迈斯半导体开发的精密直方图数据和智能软件算法,其 ToF 传感器:

  • 能够检测和抵消盖玻片的影响
  • 不受盖玻片反射引起的污点和串扰影响
  • 适应大的空气间隙
  • 保持精确的距离检测,不受物体颜色、反射率和质地影响
  • 能够测量到视野中多个物体的距离
ToF Histogram

3D dToF Solution

The implementation of 3D direct Time-of-Flight in mobile devices promises to spark the next wave of killer consumer applications, from photography enhancement to AR interactions. 
Integrating ams’ 3D optical sensing solutions with a partner’s advanced middleware and software for simultaneous localization and mapping (SLAM) and 3D image processing offers the option for manufacturers to quickly and more simply implement augmented reality (AR) functions on mobile devices. Read also our press release about 3D direct Time-of-Flight.

ams expects to be production ready soon with a fully integrated 3D dToF sensing solution superior to any existing implementation. Features will include: 

  • Superior detect range at constant resolution and absolute precision in all lighting conditions including outdoors – not possible in other 3D solutions
  • Best-in-class high ambient light immunity – 20x higher peak power compared to 3D ToF solutions currently available in the market
  • Lowest average power consumption optimized for mobile – for room scanning distance range at high framerate (>30fps)
mobile 3D dToF AR