2019

ams awarded GSA Outstanding EMEA Semiconductor Company; CEO Alexander Everke recognized by AspenCore as Executive of the Year, Global

ams received a number industry awards in 2019 in Asia Pacific, Europe and the United States

ams divests MEMS microphone interface ASIC design assets to Knowles Corporation

Building on long-term ams/Knowles relationship, transaction reflects ams’ continuing focus on sensor solutions

New image sensor evaluation kits to spark innovation with miniature cameras in consumer applications

Raspberry Pi and Arduino based NanEyeC evaluation kits support implementation of eye tracking, presence detection and object recognition in products such as virtual reality headsets, smart lighting and Home and Building Automation

Innovative ams chip for X-ray detection heralds new era of lower-cost CT medical imaging

AS5950 combines photosensor array and ADC in a single chip, reducing complexity and cost of sensor assembly in 8- and 16-slice CT scanners

ams to boost automotive electrification with launch of first inductive position sensor for high-speed motors

Innovative AS5715 sensor IC provides cost, size and weight savings compared to the resolvers in common use in vehicles today

ams announces start of additional acceptance period of takeover offer for OSRAM

Acceptance level of 59.3% achieved during the main offer period

ams announces acceptance threshold for ams’ takeover offer for OSRAM is satisfied

ams has today exceeded the minimum acceptance threshold of 55%

Last day to tender into ams Offer for OSRAM; acceptance level currently stands at 39.8%

Last chance for OSRAM shareholders to secure the attractive EUR 41.00 ams Offer

ams encourages all OSRAM shareholders to tender into the Offer to ensure achieving the minimum acceptance threshold of 55%

Horizon2020-supported Highly Integrated Optical Sensors project successfully completed

The HIOS consortium developed and launched the world’s first light sensor with fully integrated optical stack including multiple filters, lenses and an aperture replacing multiple discrete components

ams offer supported by OSRAM; ams has entered into Business Combination Agreement with OSRAM

Hot property: best-in-class ams temperature sensors

ams’ new generation temperature sensors deliver industry-best combination of accuracy and ultra-low power consumption in a tiny wafer level package

艾迈斯半导体新款高灵敏度光学传感器可以消除闪变伪影，为智能手机拍摄提供无闪烁条纹、无失真的照片和视频

摘要：新推出的TCS3408使智能手机摄像头图像系统在所有光照条件下，都能准确测量和消除环境光闪变

ams reports third quarter revenues above top end of guidance range with strong operating profitability well above expectations; high volume ramps in consumer optical solutions ...

Selected financial information for the third quarter 2019

ams to launch new takeover offer for OSRAM at EUR 41.00 per share with minimum acceptance threshold of 55%

New ams Active Stereo Vision system boosts 3D adoption in smart phones, HABA and IoT

Active Stereo Vision system from ams combines new projectors, cameras and software to provide a complete, off-the-shelf system

“Top of Styria” Award for ams’ CEO Alexander Everke

ams offer for OSRAM did not achieve minimum acceptance threshold; ams remains committed to pursue the acquisition of OSRAM

ams has increased direct shareholding in OSRAM to 19.99%, its targeted maximum direct shareholding for regulatory reasons

ams offer for OSRAM expires tomorrow, 1 October, at 24:00 CEST

ams is the largest shareholder in OSRAM with a direct shareholding of 14.69%

ams presents best and final takeover offer for OSRAM at EUR 41.00 per share expiring on 1 October

艾迈斯半导体推出工作范围得到扩展、体积更小的dToF模块，使智能手机能够准确测量距离

该模块支持智能手机摄像头实施激光检测自动对焦，即使在覆盖玻璃脏污的情况下，也能准确瞄准目标和测量距离。

ams expects to hold EGM to approve EUR 1.5 billion equity issuance around end of October; lowers acceptance threshold of offer for OSRAM ...

全球体积最小的数字红外接近传感器模块为开发更小、更轻、始终可用的耳塞铺平了道路

艾迈斯半导体推出的新款TMD2635采用体积仅为1mm3的接近监测触发器，有助于延长充电后的使用时间

ams announces start of acceptance period of takeover offer for OSRAM Licht AG

ams to launch takeover offer at €38.50 per OSRAM share following waiver of standstill

ams sees Business Combination Agreement (BCA) negotiations with OSRAM moving ahead ...

ams submitted a proposal to OSRAM for a takeover offer at a price of €38.50 per share

New Technical Lab supports implementation of ultra-sonic water metering across Greater China

Utility companies in China to gain dramatically higher visibility of loads in the distribution pipeline via real-time data acquisition

艾迈斯半导体和SmartSens就3D和NIR传感器开展合作

该项合作旨在加快市场交付速度，扩大3D产品在移动设备、计算机、消费电子和汽车等领域的多元化应用

艾迈斯半导体再斩殊荣，被Sensors Expo授予 “最佳传感器创新奖”和“最佳设计和工程团队”两项桂冠

艾迈斯半导体再斩殊荣，被Sensors Expo授予 “最佳传感器创新奖”和“最佳设计和工程团队”两项桂冠

New ams/MEGVII partnership for plug-and-play solutions enabling 3D face recognition in any smart device

Faster market delivery & broadening of the partners’ 3D product range for consumer, smart home and automotive application areas

艾迈斯半导体新款芯片加速超声波水表的开发与应用

中国积成电子公司的新超声波水流量计量模块利用艾迈斯半导体TDC-GP30传感器芯片确保高精确性、低功耗和长使用寿命

艾迈斯半导体音频技术助力半入耳式无线耳塞实现聆听体验重大突破

艾迈斯半导体音频技术助力半入耳式无线耳塞实现聆听体验重大突破

ams showcases sensing solutions for wearables, Home/Building, IoT, mobile, and consumers at MWC Shanghai

Multiple world-first sensor innovations speed up application innovation in Asian markets

ams to light up Sensors Expo 2019 with innovative demonstrations of new optical sensor technologies

Industry-first use cases in automotive, medical, consumer and industrial applications

ams Invites Austrian Homeless World Cup Players to Improve their Life and Work Opportunities

Full program included attending the European Football Championship Match between Austria and Slovenia, and meeting Austria/FC Bayern player, David Alaba

ams Enables Homeless to Change their Lives through Football

Supports Caritas Austria Homelessness Goals by Sponsoring both Austrian National Teams’ Participation in the Homeless World Cup

艾迈斯半导体与Ibeo、ZF合作推出业界首款面向汽车行业的固态LiDAR系统

艾迈斯半导体独有的激光器阵列技术为Ibeo和ZF带来业界首款固态LiDAR系统

ams is an official partner of Projekt Spielberg

ams becomes a logo partner at the popular leisure attraction in the heart of Austria

ams and Wise Road Capital advance further development for environmental, ...

ams sensing technology expertise combined with Wise Road Capital’s China market access create a powerful combination

ams begins “Sensor Innovation Challenge” with Graz University of Technology

Students of Graz University of Technology are challenged to find a new use case for a brand new spectral sensor.

艾迈斯半导体推出时间-数字转换器，提供高精度光学测距和3D扫描

AS6500采用小型6mm x 6mm封装，测量时间间隔精度达10ps

艾迈斯半导体推出新型智能健康传感器使移动消费设备具备医疗级心血管监控功能

AS7026小型光学传感器可使腕带、智能手表和其他移动设备实现心率、血压和ECG的全天候测量

艾迈斯半导体推出具备50/60Hz闪变检测功能的新型光传感器帮助手机稳定地拍摄精美照片

新型TCS3707具备闪变检测功能，可消除人工光源拍摄图像中的条带和其他缺陷

ams unveils slim IR laser flood illuminator optimized for 3D optical sensing in mobile devices

MERANO-PD flood illuminator offers the high beam control and quality needed in face recognition, 3D scanning and AR/VR applications

艾迈斯半导体第三次获得小米供应商“最佳创新奖”

艾迈斯半导体高度创新的解决方案助推小米的革新产品业务大获成功

艾迈斯半导体在 2019 年世界移动通信大会 (MWC) 上展示如何使用传感器解决方案实现“智能连接”

多项世界领先的传感器创新技术助力满足下一代消费需求

艾迈斯半导体推出新型多通道光谱传感器，促进移动颜色和光测量市场发展

AS7341提供多通道测量和光源闪烁检测功能，灵敏度高，尺寸小巧，有助于提升颜色分析、自动白平衡和颜色匹配等应用的性能，带来更高价值。

艾迈斯半导体推出全球最小的 1D 飞行时间传感器，实现智能手机精准接近传感和距离测量

新款 TMF8701 的特性包括卓越的污迹和污垢抑制，环境光高抗干扰性以及严格控制的视场

艾迈斯半导体推出光学传感器，用于测量智能手机 OLED 屏后环境光

新产品 TCS3701 可在 OLED 显示屏下进行传感器操作，测量智能手机的前置环境光和接近传感，以此实现显示屏尺寸最大化

艾迈斯半导体与专业软件公司旷视科技合作，简化 3D 光学传感技术的实施

通过艾迈斯半导体传感器解决方案与旷视科技算法之间的紧密集成，电子产品制造商能够更快速、更顺利地实施脸部识别等 3D 光学传感技术