Tech- Packaging - SiP banner

Tech - Packaging - SiP description

System in Package

The ams SiP (System in Package) is a leaded package for sensor products. This package type is designed for magnetic sensing applications, which call for a non-magnetic lead frame and careful control of the distance between the Hall sensing element and the magnetic field. The package consists of two molded units, with the sensor IC in the head and the additional passive components in the body of the package.

 

The integration of supporting components alongside the sensor in a single package reduces the system’s footprint, lowers system costs, and relieves the manufacturer of the cost and time involved in developing and assembling a PCB. 

 

A SiP is also far less sensitive to incorrect placement. Therefore, it provides more accurate and reliable sensor measurements. A SiP is flexible in its installation and orientation.

 

Tech - Packaging - SiP video

SiP design

With SiP technology the unit sensor and associated external passive components are integrated into one small housing. This reduces the footprint, lowers system costs, and frees the manufacturer of the need and cost to develop and assemble a PCB. A SiP is far less sensitive to incorrect placement. Therefore, it provides more accurate and reliable sensor measurements. SiP is flexible in its installation and orientation.

 

Tech - Packaging - SiP features

Features

  • Resistant to electromagnetic disturbances
  • System cost reduction
  • Easier implementation of functional safety designs
  • Higher immunity to environmental interference and contamination
  • More accurate placement of the sensor in relation to the target magnet

Tech - Packaging - SiP benefits

Benefits

  • High reliability
  • Small form factor
  • No need for additional PCB
  • Supports compliance with ASIL requirements
  • Ideal for applications in harsh environments
  • Less angle error caused by misalignment