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Developing of fundamentals to increase the yield and
reliability of 3D-integrated microelectronic systems including the development of robust designs and processes for advanced connectivity technology in electronic circuits
In this project, all competence is brought together for successful sensing and design of environmental noises and sounds. This opens innovation potential for inexpensive and intelligent acoustic sensing and for the active design of an enhanced audio ambience.
ASD is a follow-up of the successful K-project „Advanced Audio Processing – AAP“ (www.comet-aap.at) from the 1st Call of COMET K-projects with an extended consortium and a new focus with regards to content.
COLODOR tackles the need for compact VOC detection systems by proposing a new optical multi-parameter gas sensor concept that relies on dye doped polymers. The key objectives are:
- Research on these novel sensing materials and their local deposition on a sensor chip
- Realization of a self-contained photonic gas sensor chip
- Proof of the optical VOC sensing principle and evaluation of the sensor performance
The concept enables a small form factor, operation at room temperature and low power consumption. The project puts an emphasis on compatibility with cost-effective mass fabrication technologies to ensure a smooth transfer of the results to commercial products.
This project deals with the investigation and development of circuits, characterized by high immunity to radiation. Structures and components should be examined, evaluated and improved. Novel circuits with high robustness are to be developed.
The scope of this project is the high-resolution analysis of internal interfaces in multilayer materials for electronic devices via aberration corrected STEM combined with HR EELS and EDS. For this purpose, a variety of different approaches for both, data acquisition and data analysis, is consequently refined to provide reliable and reproducible datasets with high accuracy in spatial and energetic resolution as well as in terms of quantitative reliability. At the same time, TEM sample preparation methods are sufficiently enhanced and modified to provide specimens with adequate quality.
In the Nanospec project seven European partners joint their forces to develop an advanced upconverting system that significantly enhances solar cell efficiencies. Key developments were the upconverter material, the combination with a second luminescent material to enlarge the used spectral region, photonic structures for photon management and efficient solar cells.
The integration of laser light sources in silicon nanophotonic chips is a strongly demanded feature for a wide range of applications. Apart from data and telecom, optical sensing represents a highly attractive field of application. Within this research project, the necessary steps to realize such an optically pumped laser light source on silicon nitride waveguides will be elaborated
PHELICITI pursues the challenging task to co-integrate photonic and electronic subsystems on a single, 3D-integrated chip. As a collaborative project it gathers academia, research centers and two industrial partners in the field of semiconductor manufacturing and telecommunications.
Polymers play an indispensable role. Whether printed circuit boards for our mobile phones or high voltage generators and transformers - the right use of polymer-based materials delivers better performance and greater efficiency.
Development of an innovative process chain and production tools for the industrial fabrication of CMOS based 3D-integrated nanosensors on wafer-scale
Excellent Technologies for Cognitive Products und Cognitive Production Systems
Pro²Future is a so called COMET Centre publicly funded by the Austrian Competence Centres Program COMET (Competence Centres for Excellent Technologies). Pro²Future’s core is a highly ambitious research program which was jointly established by industry and academia.
Integrated computational material, process and product engineering
Hochintegrierter Time of Flight Sensor
Im Rahmen von “ ToF Excellence” entwickelt ams einen hochintegrierten, ultraschnellen Time-of-Flight Sensor, der vorwiegend in mobilen Geräten für den Autofokus der Kamera eingesetzt wird. Der laserbasierte Autofokus IC entsteht unter Berücksichtigung eines neuen Halbleiter-Technologieknotens, was eine bessere Performance bei höherer Integrationsdichte der einzelnen Komponenten erlaubt. Dieser Sensor ermöglicht eine deutlich schnellere und zuverlässigere Autofokusierung der Kamera, als gegenwärtig mittels herkömmlicher Technologien erreichbar ist.
Dieses Projekt wird aus Mitteln des Europäischen Fonds für regionale Entwicklung kofinanziert. Nähere Informationen zu IWB/EFRE finden Sie auf www.efre.gv.at
180/150nm Pilotlinie