자산 발행인
PCN number
Date of issue
Content in short
PCN type
Part-Nr.
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20-2019 November 2019 Epoxy Change for all NanEye 2D Camera Modules & Connector Process change please refer to product list
39-2019 November 2019 Test Verification Update for ENS210-LQFM Process change ENS210-LQFM
25-2019 July 2019 Discontinuance and replacement the marking from top to bottom side of AS72xx product family Customer information please refer to product list
08-2019 4LS May 2019 Move of Test & Logistics from Nuremberg to Focuz Process change please refer to product list
08-2019 Dragster May 2019 Move of Test & Logistics from Nuremberg to Focuz Process change please refer to product list
08-2019 NanEye May 2019 Move of Test & Logistics from Nuremberg to Focuz Process Change please refer to product list
13-2019 May 2019 Additional source bumping supplier/Exchange of cyanide zincation Process change TSL2584TSVM CSP
16-2019 (CMV20k & CMV50k) May 2019 Change from standard to customized JEDEC trays Process change please refer to product list
16-2019 (CMV2k & CMV4k) May 2019 Change to packing in JEDEC trays Process change please refer to product lists
01-2019 February 2019 Relocation Design Center Antwerp, Belgium Process Change CMV300, CMV2000, CMV4000, CMV12000, CMV20000 CMV50000CHR71000ES-xxxx,...
37-2018 December 2018 Performance Limitation Process Change AS3956
38-2018 (AS5600, AS5601) December 2018 Change of polyimide wafer coating - Fab B Process Change AS5600, AS5601
38-2018 December 2018 Change of polyimide wafer coating - Fab B Process Change AS5900, AS5600, AS5601, AS5047, AS5048, AS5140, AS5145, AS5147, AS5161, AS5162, AS5170, AS5171, AS5172, AS5200, AS5215, AS5245, AS5247, AS5262, AS5270, AS5403, AS5410, AS8222, AS8525, AS8650
DR CN 01 November 2018 Change of final device test location/product label Process Change please refer to product list
34-2018 November 2018 Performance limitation AS3955A Process Change AS3955A
25-2018 July 2018 Second site for backend final testing Process Change AS5510-DWLx
DR PCR 04 July 2018 Change of final device test location Process Change pls. refer to product list
23-2018 July 2018 Exchange of pretreatment chemistry Process Change TSL2584TSV
25-2018 July 2018 Second site for backend final testing Process Change AS3956-ATWx
13-2018 May 2018 New Wafer Sort Test Facility Process Change AS5132
13-2018 May 2018 New Wafer Sort Test Facility Process Change AS5162
13-2018 May 2018 New Wafer Sort Test Facility Process Change AS5262
13-2018 May 2018 New Wafer Sort Test Facility Process Change AS5600
13-2018 May 2018 New Wafer Sort Test Facility Process Change AS5601
NanEye-PCR-11 May 2018 Supply Chain Update Process Change NE2D_CHIP_B&W_SGA CON / NE2D_CHIP_RGB_SGA CON
14-2018 Apr 2018 Datasheet change Process Change TCS3430
08-2018 Mar 2018 Burn in product transfer Process Change AS5145B, AS5403E, AS8223
09-2018 Mar 2018 Filter Equipment Change Process Change TSL2584TSV
09-2018 Mar 2018, April 2018 Filter Equipment Change Process Change TSL2584TSV, AS7000
10-2018 (Dragstar-PCR-03) Mar 2018 Glass cover tape Process Change Pls refer to notification
05-2018 Feb 2018 NanEye2D Supply Chain update Process Change Pls refer to notification
01-2018 Jan 2018 Test location move - Test platform transfer Process Change ENS210
Dragster PCR-02 Oct 2017 LCC Serial number Laser printing Process Change Process Change
Dragster PCR-01 Oct 2017 Black mask change Process Change Dragster products
PCR-07 Sep 2017 Naneye-new cable supplier Process Change Naneye products
20-2017 Jun 2017 PCB upgrade Process Change Pls refer to notification
05-2017 Apr 2017 Change of metal plating Process Change TSL1412S, TSL1406R, TSL1406RS (addendum to EoL notification)
16-2017 Apr 2017 2nd source of wafer fabrication Process Change AS5600
16-2017 Apr 2017/Dec 2017 2nd source of wafer fabrication Process Change AS5600/AS3435, AS3415
16A-2017 Apr 2017 2nd source of wafer fabrication Process Change AS5162
08-2017 Feb 2017 Assembly House Change Process Change PCAP01AD
21-2016 Nov 2016 MOQ number on reel increased Change CCS801B, CCS811B, CCS803A
24-2016 Oct 2016 Performance improvement Redesign AS3955
18-2016 Aug 2016 Leadframe change Process Change Pls refer to notification
17-2016 Jul 2016 Terminal plating and Saw type of QFN Process Change TDC-GP2
11-2016 May 2016 Redesign AS3701x Redesign Pls refer to notification
11-2015 Jan 2016 WLCSP Product Transfer from Flipchip Int. to DECA Technologies Process Change Pls refer to notification
PCN01-2014 Feb 2015 MLF Assy Site Transfer_Amkor Change Pls refer to notification
31-2014 Jan 2015 Second source of wafer fabrication Process Change AS3911B-AQFx / AS3415-EQFx / AS3435-EQFx / AS3415-35-ESWB
PCN38-2018 December 2018 Change of Polyimide Wafer Coating Material used in our Fab B Process Change AS5900
PCN05A-2018 (NanEye-PCR-08A) October 2018 NanEye2D Supply Chain Update Progress Change NanEye SD products
03-2020 January 2020 1x reflow step at ams' Assembly House Process change TMF8701, TMF8801
04-2020 January 2020 Test Location and Test Platform Change for CMV12000 Process change CMV12000 - please refer to product list
05-2020 January 2020 Dragster Product Changes Process change please refer to product list
07-2020 February 2020 NanEye2D Supply Chain update for 2x2 version (revision of the PCN05-2018) Process change NanEye2D

자산 발행인
CN number
Date of issue
Content in short
CN type
Part-Nr.
Download
06-2019 March 2019 Change of packing specification Customer information ENS210-LQFM
03-2019 February 2019 Molex connector Customer information please refer to product list
04-2019 February 2019 CCS811 datasheet update Customer information CCS811
24-2018 August 2018 New wafer inking tool Customer information AS2522BF SD F, AS2524F SD F, AS5040 SD Fx, SL900A-ASDF SD F
18-2018 May 2018 updated CCS811 datasheet customer information CCS811B
15-2018 May 2018 change to the recommended application circuit and MOX software libaries for CCS801 customer information CCS801B
11-2018 April 2018 test diode pads unbonding customer information CHR70M
11-2018 April 2018 test diode pads unbonding customer information CMV12000
11-2018 April 2018 test diode pads unbonding customer information CMV2000
11-2018 April 2018 test diode pads unbonding customer information CMV20000
11-2018 April 2018 test diode pads unbonding customer information CMV4000
02-2018 Mar 2018 Change of firmware application Customer information CCS811B
03-2018 Feb 2018 Change notification for ENS210 datasheet Customer information ENS210
06-2018 Feb 2018 Marking change Customer information TMD2725x
25-2017 Oct 2017 Updates to CCS811 Datasheet Customer information CCS811B
18-2017 Aug 2017 PTSM sensors - new shrink tube Customer information Pls refer to notification
13-2017 Mar 2017 MOQ amendment Customer information Pls refer to notification
05-2017 Mar 2017 Change of trace code marking Customer information CCS801, CCS811
01-2017 Jan 2017 Datasheet Change Customer Information CCS801B
26-2016 Dec 2016 Datasheet Change Customer Information AS5043A/D/E
15-2016 Jun 2016 Label change (TSL26721FN and TMD27723) Customer Information Pls refer to notification
08-2020 February 2020 datasheet change update Customer information NanEye NE2D_RGB_FOV160_F2.4_2m, NE2D_B&W_FOV160_F2.4_2m
09-2020 March 2020 Digital Augmented Hearing firmware upgrade capability Customer information AS3460