| 25-2019 | July 2019 | Discontinuance and replacement the marking from top to bottom side of AS72xx product family | Customer information | please refer to product list | |
| 20-2019 | July 2019 | Backside Epoxy Change for All NanEye 2D Camera Modules | Process change | please refer to product list | |
| 08-2019 4LS | May 2019 | Move of Test & Logistics from Nuremberg to Focuz | Process change | please refer to product list | |
| 08-2019 Dragster | May 2019 | Move of Test & Logistics from Nuremberg to Focuz | Process change | please refer to product list | |
| 08-2019 NanEye | May 2019 | Move of Test & Logistics from Nuremberg to Focuz | Process Change | please refer to product list | |
| 13-2019 | May 2019 | Additional source bumping supplier/Exchange of cyanide zincation | Process change | TSL2584TSVM CSP | |
| 16-2019 (CMV20k & CMV50k) | May 2019 | Change from standard to customized JEDEC trays | Process change | please refer to product list | |
| 16-2019 (CMV2k & CMV4k) | May 2019 | Change to packing in JEDEC trays | Process change | please refer to product lists | |
| 01-2019 | February 2019 | Relocation Design Center Antwerp, Belgium | Process Change | CMV300, CMV2000, CMV4000, CMV12000, CMV20000 CMV50000CHR71000ES-xxxx,... | |
| 37-2018 | December 2018 | Performance Limitation | Process Change | AS3956 | |
| 38-2018 (AS5600, AS5601) | December 2018 | Change of polyimide wafer coating - Fab B | Process Change | AS5600, AS5601 | |
| 38-2018 | December 2018 | Change of polyimide wafer coating - Fab B | Process Change | AS5900, AS5600, AS5601, AS5047, AS5048, AS5140, AS5145, AS5147, AS5161, AS5162, AS5170, AS5171, AS5172, AS5200, AS5215, AS5245, AS5247, AS5262, AS5270, AS5403, AS5410, AS8222, AS8525, AS8650 | |
| DR CN 01 | November 2018 | Change of final device test location/product label | Process Change | please refer to product list | |
| 34-2018 | November 2018 | Performance limitation AS3955A | Process Change | AS3955A | |
| 25-2018 | July 2018 | Second site for backend final testing | Process Change | AS5510-DWLx | |
| DR PCR 04 | July 2018 | Change of final device test location | Process Change | pls. refer to product list | |
| 23-2018 | July 2018 | Exchange of pretreatment chemistry | Process Change | TSL2584TSV | |
| 25-2018 | July 2018 | Second site for backend final testing | Process Change | AS3956-ATWx | |
| 13-2018 | May 2018 | New Wafer Sort Test Facility | Process Change | AS5132 | |
| 13-2018 | May 2018 | New Wafer Sort Test Facility | Process Change | AS5162 | |
| 13-2018 | May 2018 | New Wafer Sort Test Facility | Process Change | AS5262 | |
| 13-2018 | May 2018 | New Wafer Sort Test Facility | Process Change | AS5600 | |
| 13-2018 | May 2018 | New Wafer Sort Test Facility | Process Change | AS5601 | |
| NanEye-PCR-11 | May 2018 | Supply Chain Update | Process Change | NE2D_CHIP_B&W_SGA CON / NE2D_CHIP_RGB_SGA CON | |
| 14-2018 | Apr 2018 | Datasheet change | Process Change | TCS3430 | |
| 08-2018 | Mar 2018 | Burn in product transfer | Process Change | AS5145B, AS5403E, AS8223 | |
| 09-2018 | Mar 2018 | Filter Equipment Change | Process Change | TSL2584TSV | |
| 09-2018 | Mar 2018, April 2018 | Filter Equipment Change | Process Change | TSL2584TSV, AS7000 | |
| 10-2018 (Dragstar-PCR-03) | Mar 2018 | Glass cover tape | Process Change | Pls refer to notification | |
| 05-2018 | Feb 2018 | NanEye2D Supply Chain update | Process Change | Pls refer to notification | |
| 01-2018 | Jan 2018 | Test location move - Test platform transfer | Process Change | ENS210 | |
| Dragster PCR-02 | Oct 2017 | LCC Serial number Laser printing | Process Change | Process Change | |
| Dragster PCR-01 | Oct 2017 | Black mask change | Process Change | Dragster products | |
| PCR-07 | Sep 2017 | Naneye-new cable supplier | Process Change | Naneye products | |
| 20-2017 | Jun 2017 | PCB upgrade | Process Change | Pls refer to notification | |
| 05-2017 | Apr 2017 | Change of metal plating | Process Change | TSL1412S, TSL1406R, TSL1406RS (addendum to EoL notification) | |
| 16-2017 | Apr 2017 | 2nd source of wafer fabrication | Process Change | AS5600 | |
| 16-2017 | Apr 2017/Dec 2017 | 2nd source of wafer fabrication | Process Change | AS5600/AS3435, AS3415 | |
| 16A-2017 | Apr 2017 | 2nd source of wafer fabrication | Process Change | AS5162 | |
| 08-2017 | Feb 2017 | Assembly House Change | Process Change | PCAP01AD | |
| 21-2016 | Nov 2016 | MOQ number on reel increased | Change | CCS801B, CCS811B, CCS803A | |
| 24-2016 | Oct 2016 | Performance improvement | Redesign | AS3955 | |
| 18-2016 | Aug 2016 | Leadframe change | Process Change | Pls refer to notification | |
| 17-2016 | Jul 2016 | Terminal plating and Saw type of QFN | Process Change | TDC-GP2 | |
| 11-2016 | May 2016 | Redesign AS3701x | Redesign | Pls refer to notification | |
| 11-2015 | Jan 2016 | WLCSP Product Transfer from Flipchip Int. to DECA Technologies | Process Change | Pls refer to notification | |
| PCN01-2014 | Feb 2015 | MLF Assy Site Transfer_Amkor | Change | Pls refer to notification | |
| 31-2014 | Jan 2015 | Second source of wafer fabrication | Process Change | AS3911B-AQFx / AS3415-EQFx / AS3435-EQFx / AS3415-35-ESWB | |
| PCN38-2018 | December 2018 | Change of Polyimide Wafer Coating Material used in our Fab B | Process Change | AS5900 | |
| PCN05A-2018 (NanEye-PCR-08A) | October 2018 | NanEye2D Supply Chain Update | Progress Change | NanEye SD products | |