EU Projects List
HIOS developed and launched the world’s first light sensor with fully integrated optical stack including multiple filters, lenses and an aperture replacing multiple discrete components.
The ADMONT – “Advanced Distributed Pilot Line for More-than-Moore Technologies” project is focused on a powerful and versatile More-than-Moore (MtM) pilot line for Europe increasing the diversification of CMOS process technologies. The distributed pilot line utilizes various MtM platform technologies for sensor and OLED processing in combination with baseline CMOS processes in a unique way and incorporates 2.5D as well as 3D integration of silicon systems into one single production flow.
ATHENIS_3D provides the industry’s first 3D integration of advanced More than Moore devices and More Moore devices (90nm and 14nm CMOS) with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP) for harshest automotive conditions including temperatures up to 200C and voltages up to 200V. Cost savings from integration and a 5x reduction of PCB area will be shown.
The objective of this work is to develop a novel computer-aided design methodology for fast modeling and simulation of destructive substrate coupling effects in integrated mixed-signal, High Voltage (HV) and High Temperature (HT) smart power ICs for automotive applications.
The EU funded Eniac project will design and develop Lithium-battery-pack systems which manage photovoltaic power feed efficiently and deliver optimized, reliable, low-cost and predictable performance. The BattMan project therefore focuses on essential elements and targets solar-powered, off-grid street lighting poles as a challenging demonstrator. It will be specified, simulated, designed, prototyped, demonstrated and validated in the project.
Within the DAKARA project an ultra-compact, energy-efficient and reconfigurable camera matrix is developed. In addition to standard color images, it provides accurate depth information in real-time, forming the basis for various applications in the automotive (autonomous driving), production (Industry 4.0) and many more.
„Energy To Smart Grid“ (E2SG) ist ein Projekt bie dem sechs deutsche Partner an neuen Technologien zur Verteilung der Energie vom Erzeuger zum Endverbraucher arbeiten. Das Ziel ihrer dreijährigen Forschungsarbeit: Die bei der Energieverteilung entstehenden Verluste um 20 Prozent senken.
E2SWITCH focuses on Tunnel FET (TFETs) as most promising energy efficient device candidates able to reduce the voltage supply of integrated circuits (ICs) below 0.25V and make them significantly more energy efficient by exploiting strained SiGe/Ge and III-V platforms, with CMOS technological compatibility
The aim of this project is to develop a capsule endoscope, which significantly reduces the amount of data generated by motion-controlled image acquisition. This means, on the one hand, an accelerated evaluation of the examination by the doctor, while at the same time, due to the saved data volume, allows the use of a high-resolution camera for better diagnosis and the storage of the image data in the capsule for easier handling.
“Eyes of Things” is an international project focused on building an open embedded computer vision platform. EoT is an Innovation Action funded under the European Union’s H2020 Framework Programme. Our objective in this project is to build a power-size-cost-programmabilty optimized core vision platform that can work independently and also embedded into all types of artefacts.
The ENIAC JU project EPP combined research, development and innovation to demonstrate market readiness by industrial implementation at an early stage. Work to be performed included developing next generation power semiconductors based on 300mm wafers, setting up the required technologies as pilot line manufacturing, and demonstrating the thus achieved reliable and advantageous solutions for a wide range of ENIAC grand challenge application fields.
European research projects for energy efficiency, “eRamp” focused on the rapid introduction of new production technologies, such as packaging technologies for energy-saving chips. The eRamp project covered the entire power electronics value chain, from generation and transmission all the way to consumption.
ESEE – Environment Sensors for Energy Efficiency targets the markets, were with highly reliable information regarding environmental conditions measures can be deducted, which safe the use of energy. The ENIAC JU project ESEE developed wireless sensor networks for smart management of the air conditioning systems in offices and other public buildings, in homes, and in specific closed environments such as an aircraft cabin, demonstrating significant energy savings and applicability to other systems in which the energy consumption depends upon human presence like heating or lighting.
The ESTRELIA platform will enable a significant advancement of the technology capabilities for battery management systems design. A focused approach on the battery management system on the one hand but also the cost effective system integration into the vehicles on the other hand.
This project will research new technologies for CMOS image sensors that are needed in the next generation of several application domains.The image sensor research will focus on enhancing the capabilities of current imaging devices
HIOS – “Highly Integrated Optoelectronic Sensor” aims to develop and launch the world’s first light sensor with fully integrated optical stack, including multiple filters, lenses and an aperture replacing multiple discrete components.
Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden, Regensburg) and one backend (Regensburg) lines networking with existing highly specialized manufacturing lines.
The L3MATRIX project provides novel technological innovations in the fields of silicon photonics (SiP) and 3D device integration. The project will develop a novel SiP matrix with a scale larger than any similar device with more than 100 modulators on a single chip and will integrate embedded laser sources with a logic chip thus breaking the limitations on the bandwidth-distance product
The CATRENE MASTER_3D project will contribute to the transformation of European Union leadership in the R&D of 3D integrated circuits (ICs) into 3D IC manufacturing leadership. Manufacturing methods to maximise process robustness and yield, minimise ramp-up time, support high volume production and reduce manufacturing cost will be developed and implemented in consortium members’ fabs.
The mission of the MATTHEW project is to enable new applications and services on mobile devices. It will overcome the limitation of current passive NFC transmission technologies by active modulation and offer new ways of exchanging roles from one secure entity like a nanoSIM or a microSDTM card to another with novel security and privacy approaches.
MIRAGE aims to implement cost-optimized components for terabit optical interconnects introducing new multiplexing concepts through the development of a flexible, future-proof 3D “optical engine”. MIRAGE is a 3-year collaborative project on photonic integration that brings together eight leading European universities, research centers and companies. The project was launched in October 2012 and is co-funded by the European Commission through the Seventh Framework Programme (FP 7).
The MSP project - Multi Sensor Platform for Smart Building Management - is focused on the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The MSP-project employs Through-Silicon-Via (TSV) technology for 3D-integration of these devices on CMOS electronic platform chips to innovative smart systems capable for indoor and outdoor environmental monitoring.
The Nanonest2Sense project aims at developing a low cost technology that could provide affordable devices for point-of-care detection of molecules of interest for health monitoring or pre-diagnostics.The Project has the objective to develop a new technological approach for the 3D CMOS integration of label-free sensors for medical applications.
A novel CMOS compatible low-loss silicon nitride waveguide based PIC technology platform will be developed in OCTCHIP and directly applied to the a strong business case in the field of optical coherence tomography (OCT) for ophthalmology. OCT is a revolutionizing in-vivo 3D imaging technique for non-invasive optical biopsy addressing medical needs with early diagnosis and reduction of healthcare cost.
Photonics is essential in today’s life science technology. PIX4life will mature a state of the art silicon nitride (SiN) photonics pilot line for life science applications in the visible range and pave the way to make it accessible as an enabler for product development by a broad range of industrial customers.
PLASMOfab aims to develop CMOS compatible plasmonics in a generic planar integration process as the means to consolidate photonic and electronic integration. Wafer scale integration will be used by PLASMOfab to demonstrate low cost, volume manufacturing and high yield of powerful PICs. The new integration technology will unravel a series of innovations with profound benefits of enhanced light-matter interaction enabled by plasmonics in optical transmitters and biosensors modules.
The Innovation Action (IA) project “PowerBase” will follow a holistic vertical approach from material research across the entire value chain to advanced systems and aims to provide significant impact to essential technologies and key application.
The research project PhoxTroT completed successfully its activities delivering the revolutionary optical interconnect solutions towards High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing Systems exploiting existing photonic technologies in a holistic way, synergizing the different fabrication platforms in order to deploy the optimal “mix&match” technology and tailor this to each interconnect layer.
The main objective of the SAFESENS project is to obtain earlier and more reliable fire detection in combination with accurate occupancy detection by co-integrating multiple gas sensor and presence detection technologies in both building safety systems and personal monitors.
STREAM, Smart Sensor Technologies and Training for Radiation Enhanced Applications and Measurements, is an Innovative Training Network
(ITN). STREAM is a career development network on scientific design, construction and manufacturing of advanced radiation instrumentation. It targets the development of innovative radiation-hard, smart CMOS sensor technologies for scientific and industrial applications.
Circuit Stability Under Process Variability and Electro-Thermal-Mechanical Coupling.
The SUPERTHEME project worked on overcoming the weaknesses currently limiting the use of TCAD to study process variability and its interaction with electro-thermal-mechanical effects.
The mission of the TRACE project is to assess the potential of movement tracking services to better plan and promote walking and cycling in cities, and develop tracking tools that will fuel the take up of walking and cycling measures.The project targets established measures to promote cycling and walking to the workplace, to school, for shopping purposes or simply for leisure
TRITON stands for TRusted vessel Information from Trusted On-board iNstrumentation and aimed at improving the intrinsic robustness of some on-board equipment used in SRSs, namely the Automatic Identification System (AIS) and the Global Navigation Satellite System (GNSS) receiver. The project wanted to increase the awareness on the problem of cyber-attacks and contributed to increase the overall trustworthiness of SRSs and, in turn, the security of the maritime domain as a whole
The target of this project is to prepare and train future engineers for the design challenges and opportunities provided by modern optics technology. Such challenges include lossless photon management, modelling at the system, components and feature level, and the link between design and technology