Job no.

006986

Position Type

Research & Development

Working time

• Regular Fulltime

Place of employment

Premstätten

What we offer:

Your tasks and responsibilities

• Reliability simulation and risk assessment of semiconductor packages with focus on thermal and (thermo-)mechanical design
• Calibration and validation of simulation by experiment
• Lead package and technology development projects
• Work with suppliers to develop and industrialize packages
• Development/improvement of simulation and back-end material characterization techniques
• Coordinate characterization of new materials and implementation of results in database

Your education and experiences

• Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
• Experience in semiconductor package development and/or modelling and simulation is a benefit
• FE simulation experience (COMSOL, Ansys, Abaqus)
• Basic knowledge of thermal and thermo-mechanical analysis of materials
• Basic knowledge of MEMS and CMOS manufacturing technologies
• CAD software skills are a benefit
• Demonstrated analytical and problem solving skills

Collective salary and wage agreement

We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/wp-content/uploads/2019/06/Angestellte-2019-04-09.pdf).
We offer a higher compensation depending on your expertise and skills.