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Engineer, Process Development (Grinding/Lapping/Polishing) - AMK, Singapore

Engineer, Process Development (Grinding/Lapping/Polishing)

Job no.


Position Type

Research & Development

Working time

  • Regular Fulltime

Place of employment


What we offer:

Your tasks and responsibilities

  • Define device, technology design rules and target specifications
  • Create process flows with process specifications
  • Process module development and characterization
  • Define structures for process integration and process module development
  • Design statistical experiments and analyze results to optimize device architecture and/or process modules
  • Coordinate process unit and process module development
  • Drive process and device optimization

Your education and experiences

  • Degree in engineering or its equivalent with minimum 3 years exposure to Semiconductor field
  • More than 2 years of hands-on experience in wire-cut process
  • Strong knowledge on FMEA, control plan, 8D, root cause analysis, SPC and DOE
  • In-depth understanding of interaction between chemical (glue, surfactant, diamond wire) vs. glass material with respect to current product CTQ (parallelism, chipping, perpendicularity)
  • Glass material know-how & its optimum corresponding CMP process with respect to current product CTQ (parallelism, chipping, perpendicularity)
  • Familiar with semiconductor analysis tools (JMP, Minitab, Microsoft Office- excel)
  • Good quantitative, analytical and communication skills
  • Strong team member, able to carry out task and duties assigned within the team
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