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On-Site Package Development Engineer - Shenzhen, China

On-Site Package Development Engineer

Job no.

006069

Position Type

Research & Development

Working time

  • Regular Fulltime

Place of employment

Shenzhen

What we offer:

Your tasks and responsibilities

  • Act as primary point of contact for all ams package development activities at supplier(s) in China (mainly Zhongshan & Shanghai)
  • Manage R&D interface to key OSAT supplier(s) in China as a resident engineer or locally in the region
  • Host regular R&D alignment meetings (several times / week), track action items and organize follow-ups with supplier
  • Actively and independently drive package development projects at supplier(s) in alignment with ams package development organization
  • Establish working relationship and interface to supplier's R&D / customer support / sales team
  • Regular on-site visits to check on project progress, line visits, sample build checks, etc
  • Collaborate with other ams teams managing supplier locally (operations, supplier quality, SCM)
  • Local travels to other suppliers / partners in China, establish contacts with (potential) new suppliers in China
  • Support ams and ams' customers' audits
  • Organize and support ams team visits to supplier

Your education and experiences

  • Technical background in Physics, Chemistry, Materials Sciences, EE or other Engineering, Master's degree or higher preferred
  • Several years of experience in semiconductor / electronic packaging / assembly
  • Good knowledge of semiconductor packaging technologies, manufacturing processes and quality systems
  • Self-motivated and -driven, ability to work independently in a remote location
  • Project management skills
  • Strong communicator, ability to translate ams requirements into the language of the supplier and vice versa
  • Willingness to travel (mainly China & Asia)
  • Proficiency in both Chinese Language (Mandarin) and English is mandatory
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