Advanced packaging

ams OSRAM wafer-level integration and process technologies enable high volume manufacturing of extremely precise, miniaturized optics, sensors and modules.

By combining proprietary design technology and processes in the development of packaging solutions, we enable greater design flexibility, increased performance, reduced form factor, lower total system costs, and improved aesthetics in mobile devices.

End-to-end supply chain control, from design to manufacturing, ensures that our products are manufactured in high volume with consistent quality.

Through-Silicon-Via (TSV) packaging technology is a wafer packaging technology patented by ams OSRAM which radically reduces the height of an optical IC package.

Unlike traditional IC packages, which use wire bonds between the I/O wedge of a die and a package bond pad, a TSV does not use wire bonds but instead routes I/O signals through a tungsten deposited dedicated channel via (constructed during the silicon manufacturing process) to a solder ball through a PCB trace (called a reduced distribution trace layer).
 

Key features

• The industry’s lowest package height, just 320µm, enables the production of ultra low-profile devices.
• A TSV glassless package is handled like a Wafer-Level Chip-Scale Package (WL-CSP) but without the metal connection which is present on the side of a silicon type package. As a result, the TSV package offers superior Moisture Sensitivity Level-1 levels, Humidity Temperature-Cycling performance and corrosion resistivity.
• With no inductive wire bond connecting the IC to the package, wire-bond inductance is minimized, resulting in improved performance.
• Lower infra-red sensitivity helps improve optical accuracy in environments subject to high levels of IR ambient light. 
• Multiple optical filters may be deposited, enabling a detector’s response to light to be customized.