3D & Systems Summit

2020/01/27 - 2020/01/29

Dresden, Germany

Booth No.:

Hilton Hotel, An der Frauenkirche 5, D-01067

Event-Website:

3D & Systems Summit

Meet ams at 3D & Systems Summit

 
The 3D & Systems Summit addresses the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing. The summit focuses on high reliability and high performance of disruptive applications like Mobile and IoT.

 

ams Speaking Slots on Wednesday, January 29th
 

Session 4 - Enabling Technology
8:20-8:30 am: Opening Remarks

Speaker: Franz Schrank
Senior Manager Process R&D, ams AG

Franz Schrank has 19 years of experience in 3D integration, CMOS post processing and MEMS. Franz received the Dipl.-Ing. degree in physics and the M.A.S. degree in Nanoelectronics and Nanoanalytics at the University of Technology in Graz, Styria, Austria. He currently holds 34 patents in the field of 3D technology, MEMS and opto technology. 



Session 5 - Mobile and IoT
12:30-12:55 pm: Advanced Sensors Enabled by Photonic Co-integration 

Abstract: 3D processes, heterogeneous integration and combination with photonics are paving the way for the development of novel sensor solutions. We will present examples for sensor with optical readout based on silicon nitride photonic circuits monolithically integrated with CMOS. One of the applications is optical coherence tomography (OCT), a fast growing imaging technique in ophthalmology. Drawbacks of existing OCT systems are their high costs as well as their bulkiness, which prevents wider spread of OCT systems. To overcome both cost and size issues, optical and electrical components are integrated on a single chip. Moreover, we will also present an example of an opto-chemical gas sensor.

Speaker: Jörg Siegert,
Manager 3DWLI, ams AG 

Joerg Siegert has worked on 3D and heterogeneous integration at ams AG for over ten years and is currently managing the Process R&D team reponsible for 3D interconnect and wafer level integration development. He studied at Graz University of Technology, Austria, and KTH Royal Institute of Technology, Stockholm, Sweden, where he got his PhD degree in physics. Joerg is author and co-author of 17 publications and hold 15 patents in the fields of 3D integrated semiconductor devices and MEMS.

 

>> Read more details about the agenda

 

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