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IC Package Designer (m/f/d) - Valencia, Spain

IC Package Designer (m/f/d)

Job no.

006735

Position Type

Research & Development

Working time

  • Regular Fulltime

Place of employment

Valencia

What we offer:

Your tasks and responsibilities

  • Ensure Allegro PCB Design according to specifications and Design rules
  • Take responsibility for project effort estimations and project reviews related to PCB layout design
  • Work with multi-functional team to understand system requirements and physical design limitations
  • Drive co-optimization of physical design on Multi Layer Board (MLP), System in Package (SiP), package and silicon
  • Provide implementation guidelines and feedback to silicon, package and system design groups
  • Perform feasibility study, design verification and sign off
  • Resolve PCB design issues with fabrication and manufacturing vendors

Your education and experiences

  • Strong experience in Cadence Allegro or SIP for physical design
  • Experience in the physical design of multi-layer (MLBs) or system in package (SIP)
  • Experience in schematic capture and system integration
  • Technical degree or equivalent is necessary
  • Strong physical understanding of power and signal integrity fundamentals
  • Experience in the physical design of Power Delivery Networks (PDNs) and high-speed signals at PCB level
  • Familiar with High Density Interconnect (HDI), PCB and Flip-Chip BGA package substrate technologies
  • Ability to collaborate and work effectively with cross functional teams
  • Excellent organization and planning skills, able to work on parallel tasks
  • Base knowledge of Chip Layout or willing to learn Chip Layout
  • Familiarity with analog and mixed signal structures
  • Soft Skills: excellent communication in English and/or German, problem solving and team player
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