Engineer, Dicing Process

Job no.


Position Type

Operations & Manufacturing

Working time

  • Regular Fulltime

Place of employment


What we offer:

Your tasks and responsibilities

  • Develop good understanding and knowledge of laser dicing capabilities
  • Identify and solve challenges in existing processes
  • Hands on experience with recipe creation on dicer tools
  • Strong in SPC tools like JMP, Box plot, Excel charts
  • Monitor process performance indices on qualified processes and establish good controls to maintain process performance
  • Oversee and ensure all critical nodes for quality indices are met
  • Start up new equipment processes which involve process characterization and development
  • Ensure productivity improvement through process changes, documents, as well as implement process capability and work with equipment engineers to maximize productivity of the equipment
  • Set up SPC, control plan, FMEA and work instructions for production
  • Organize and oversee training for AEs/Technicians to upgrade their technical skills

Your education and experiences

  • Degree in Engineering or its equivalent with minimum 3 years exposure to Semiconductor / Dicing operation
  • Diploma in engineering or its equivalent with minimum 5 years of working experience, preferably in wafer backend process
  • Good quantitative, analytical and communication skills
  • Self-starter and team player with strong leadership who is comfortable working with cross-functional team
  • Willing to learn on the job, able to multi-task and possess good time management skills
  • Candidates with die sorting / wafer reconstruction experience is a plus

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