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Sensor Packaging Development Manager

Job no.

004950

Position Type

Research & Development

Working time

  • Regular Fulltime

Place of employment

AMK

What we offer:

Your tasks and responsibilities

  • • Lead and manage new process development for sensor packaging product in wafer level. • Development for new sensor packaging product development execution based on product design required and DFM. • Lead improvements in process yield, quality, cycle time, and output delivery. • Develop and implement advanced processes methodologies & metrologies. • Perform defect and failure analyses for product development failure. • Manage new process/product qualification and ramp up. • Train and lead process team

Your education and experiences

  •  Degree in Materials /Mechanical/EE/ Engineering with at least 10 years of relevant experience in wafer level industry or in a similar environment, wafer level process experience is preferred. Minimum 5 years technology development and engineering management tracking record.  Knowledge of SPC/ FMEA/DOE/OCAP and other problem solving techniques is must.  Solid skills and knowledge of DFM, wafer level related processes.  Strong leadership, communication and planning skills  Meticulous with strong ana

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Contact

 

Contact our Talent Managers