Open Position Banner

Asset Publisher

angle-left jobno-004950-Singapore

Sensor Packaging Development Manager

Job no.


Position Type

Research & Development

Working time

  • Regular Fulltime

Place of employment


What we offer:

Your tasks and responsibilities

  • • Lead and manage new process development for sensor packaging product in wafer level. • Development for new sensor packaging product development execution based on product design required and DFM. • Lead improvements in process yield, quality, cycle time, and output delivery. • Develop and implement advanced processes methodologies & metrologies. • Perform defect and failure analyses for product development failure. • Manage new process/product qualification and ramp up. • Train and lead process team

Your education and experiences

  •  Degree in Materials /Mechanical/EE/ Engineering with at least 10 years of relevant experience in wafer level industry or in a similar environment, wafer level process experience is preferred. Minimum 5 years technology development and engineering management tracking record.  Knowledge of SPC/ FMEA/DOE/OCAP and other problem solving techniques is must.  Solid skills and knowledge of DFM, wafer level related processes.  Strong leadership, communication and planning skills  Meticulous with strong ana

Set up Job Alert

Job Alert


You haven't found what you were looking for? Stay up to date and set up your personal ams job alert. Subscribe to your personal job alert now! 

HR Contact



Contact our Talent Managers