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Master Student for Chip and package co-simulation (m/f/d)

Job no.

004697

Position Type

Research & Development

Working time

  • Master/Bachelor (student) Thesis

Place of employment

Premstätten

What we offer:

Your tasks and responsibilities

  • Document the current status for chip/package/board Co-design at ams
  • Investigate and document the different cross domain effects
  • Literature and internet recherché on state of the art methods and software for Chip/Package/Board co-design
  • Evaluate the Cadence Virtuoso RF Solution flow
  • Implement the flow at ams and benchmark against other available tools
  • Prove the concept on a real life example like an illuminator (Board with VSCEL, Driver and Logic)
  • Make suggestions for future developments in this area
  • Setup a training for the new flow
  • Give a presentation at the Cadence User Group Conference

Your education and experiences

  • Advanced Electrical Engineering studies (Technical University or University of Applied Science)
  • Fluent English

Collective salary and wage agreement

The type of contract for a master thesis is a “Freier Dienstnehmer” / “freelance employment” for a duration of 6 months. During this time frame you will receive a monthly payment of EUR 1.000, - gross. Additional there is the possibility to receive a performance bonus of EUR 3.000, - gross for the successful completion of the Master Thesis.

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