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jobno-003685-Germany

Principal Engineer, Advanced IC Packaging Development

Job no.

003685

Position Type

Research & Development

Working time

  • Regular Fulltime

Place of employment

Jena

What we offer:

Your tasks and responsibilities

  • Within the design and development of spectral sensor solutions:
  • • Define advanced package requirements
  • • Select and qualify advanced package technologies, materials and surface mount processes
  • • IC package design and assembly process development
  • • Package reliability investigations and failure analysis
  • • Support production ramp-up and process optimization programs
  • • Interface to process-, assembly and product reliability engineering, test, IC design
  • • Support the selection, evaluation and co-ordination of subcon. manufacturing

Your education and experiences

  • - University degree in materials science, physics, chemistry, mechanical eng. or mechatronics
  • - Minimum 6 years practical experience in advanced IC packaging, materials and interconnections technologies
  • - Experience in optical packages, 3D-integr., Flip chip, COF beneficial.
  • - Quality and development tools: FMEA, DOE, SPC, 8D, 2D/3D design and simulation, etc.
  • - Professional experience in project management with international partners
  • - Willingness to travel and work in intercultural and interdisciplinary teams
  • - Customer oriented with good communication skills and proficiency in English and German
  • - Experience with optical ray tracing software and work with optical materials is highly welcome

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