Benefit from our product engineering capabilities and optimize your product yield using ams Product Engineering Services. ams provides foundry customers access to powerful yield analysis tools as well as excellent failure analysis capabilities:
Emission microscopy (EMMI) is an efficient optical analysis technique used to detect and localize certain failures on an integrated circuit. Emission microscopy is non-invasive and can be performed from either the front or back of devices. Emission microscopy is a powerful early-stage failure analysis technique.
Liquid Crystal Hotspot Analysis
Liquid crystal hot spot detection locates heat sources associated with the electrical failure of a device.
Hot spot detection is non-destructive and applicable whenever abnormal leakage or power is associated with a failure. The goal is to precisely identify the location of abnormal heat. The defect causing failure is often at or near the source of heat.
Contact probing, or micro-probing, of a semiconductor device offers failure analysts a fundamental tool for electronic testing. Probing individual conductors and devices lets analysts selectively inject, and measure the effects of, real-time currents and voltages on individual semiconductor devices under varying conditions. This form of device-by-device analysis proves critical when analysts must locate and identify specific types of failures.
Marking and separating of completed components for defect analysis.
Focused Ion Beam, also known as FIB, is a technique used in the integrated circuit failure analysis to cut unwanted electrical connections, and/or to deposit conductive material in order to make a connection.
Parallel lapping, also known as delayering, is a commonly used process in failure analysis, debug, and general construction analysis in the production of integrated circuits. In many cases it is necessary to remove layers from the integrated circuit for inspection, whether it be electrical testing, deposition uniformity, or device integrity investigation. Delayering is useful to remove specific device layers when evaluating the design of any device or for specific failure analysis techniques.
Cross Section Analysis
Cross section analysis provides a wealth of information about the IC device such as layer thicknesses, layer structures, grain sizes of various crystals in the layers and the existence of voids and delaminations