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Release Archive 2016


ams announces seasoned semiconductor executive Alexander Everke as CEO

Former CEO Kirk Laney continues as ams’ Chief Strategist for Sensors and remains a member of the Management Board

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Joint ams and STMicroelectronics solution enables secure NFC transactions in new ARM mbed Wearable Reference Design

Benefiting from ams’ boosted NFC technology and ST’s proven Secure NFC, ARM® mbed™ Wearable Reference Design supports IoT applica-tions including contactless ticketing, access control, payments and more

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ams präsentiert Sensoren für Mobilkommunikation am Mobile World Congress

Steirische Sensoren auf der weltgrößten Mobilfunkmesse und eine innovative unkonventionelle Präsentation ziehen das Publikum an

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Launch of ams’ tiny, cost-effective AS3412 opens up mass market opportunity for active noise cancellation

New AS3412 noise cancellation speaker driver is ideal for use in the bundled head-sets supplied with smartphones

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ams releases interoperable PDK for its 0.35µm analog specialty processes

iPDK enables foundry customers to design complex ICs with multiple EDA vendor tools

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ams wins Austrian Innovation Award sponsored by the Austrian Ministry of Science, Research and Economics

ams’ TMG399x intelligent gesture sensor family selected over 524 submissions, validating the company’s leadership in innovative sensor technologies

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ams’ foundry know-how and IP help Sarda Technologies to implement gate driver IC for ultra-efficient server power stage

ams to manufacture key component for Sarda’s Heterogeneous Integrated Power Stage (HIPS) for data centers

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New magnetic position sensors for automotive applications support full ISO26262 safety compliance and provide System-in-Package (SiP) format

AS517x devices include full data path diagnostics and enhanced self-test capabilities to enable automotive systems to comply with the highest safety standards

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Groundbreaking event in Utica, NY, signals start of construction of new ams wafer fab

ams on track with plans to start volume ramp of high-performance analog wafers at the new fabrication plant by H2 2018

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